I will be joining the University of Virginia as an Assistant Professor in the Department of Computer Science and a member of the Cyber-Physical Systems Link Lab, starting in Spring 2024!

I am looking for self-motivated Ph.D. students to join my group. Find more details here if you are interested.

Kun Qian

Kun Qian

Postdoctoral Researcher

University of California San Diego

Biography

Kun Qian is currently a postdoctoral researcher at the Department of Electrical and Computer Engineering, University of California San Diego, working with Professor Xinyu Zhang. He received his Ph.D. from the School of Software at Tsinghua University in January 2019, under the supervision of Professor Yunhao Liu and Professor Zheng Yang. Before that, he received his B.E. in Software Engineering in 2014 from the School of Software at Tsinghua University.

Education
  • Ph.D. in Software Engineering, 2019

    Tsinghua University

  • B.E. in Software Engineering, 2014

    Tsinghua University

News

  • 2023/09, Our papers NeuroRadar and Metasight got conditionally accepted by ACM Sensys 2023.
  • 2022/12, Our paper SLNet got accepted by USENIX NSDI 2023.
  • 2022/11, Our paper UniScatter got conditionally accepted by ACM MobiCom 2023.
  • 2022/01, Our paper MilliMirror got accepted by ACM MobiCom 2022.
  • PAST NEWS

Publications

UniScatter: a Metamaterial Backscatter Tag for Wideband Joint Communication and Radar Sensing
SLNet: A Spectrogram Learning Neural Network for Deep Wireless Sensing
MilliMirror: 3D Printed Reflecting Surface for Millimeter-Wave Coverage Expansion
3D Point Cloud Generation with Millimeter-Wave Radar
RoS: Passive Smart Surface for Roadside-to-Vehicle Communication
Widar3.0: Zero-Effort Cross-Domain Gesture Recognition with Wi-Fi
AIRCODE: Hidden Screen-Camera Communication on an Invisible and Inaudible Dual Channel
M-Cube: A Millimeter-Wave Massive MIMO Software Radio
Passenger Demand Prediction with Cellular Footprints

Awards

  • 2020/10, Best Paper Award, MobiCom (2/384)
  • 2018/05, Best In-Session Presentation Award, INFOCOM (1/4)
  • 2017/05, Honorable Mention Award, CHI (top 5% submission)
  • 2014/12, Best Paper Candidate, ICPADS (4/323)